Overview
Compact device design increasingly relies on flat flexible cable and board-to-board interconnects instead of discrete wire harnesses. This line handles fine-pitch FFC/FPC assembly and board-to-board cabling for space-constrained electronics designs.
Design & Construction
Flat Flexible Cable
FFC/FPC constructions use polyimide or PET film carriers at 0.5mm to 1.25mm pitch, with tinned or gold-flash contacts depending on the mating connector’s plating requirement and expected insertion-cycle count.
Board-to-Board Interconnects
Where a design calls for board-to-board rather than flex-film cabling, we build discrete jumper assemblies to match connector footprint and stack height, keeping signal integrity consistent across production lots.
Manufacturing Process
Assembly runs under our ISO 9001 quality system with continuity and insertion-force testing on sample lots, and RoHS 3 compliant materials used throughout.
Typical Applications
- Display and touch-panel FPC connections
- Camera module board-to-board cabling
- Compact consumer device internal interconnects
- Wearable device flex circuit assemblies
- Small-appliance control board interconnects
Common installations include Display and touch-panel FPC connections, Camera module board-to-board cabling, and Compact consumer device internal interconnects, where signal integrity, EMI control, and compact flex-rated construction are the primary design drivers. The same base design can also be adapted for Wearable device flex circuit assemblies and Small-appliance control board interconnects with minor changes to connector type or cable length.
Technical Specifications
Standard configurations are available with the following technical specifications; custom configurations outside these ranges can be discussed with our engineering team. Pitch: 0.5mm – 1.25mm FFC/FPC. Conductor Count: 4 – 60 conductors. Insulation: Polyimide/PET film, tinned or gold-flash contacts. Temp Range: -20°C to +85°C. Voltage Rating: Up to 30V DC. Compliance: RoHS 3, UL Recognized. Connector Options: ZIF/non-ZIF FFC, board-to-board headers.
Quality & Certification
Manufactured under ISO 9001:2015 certification, RoHS 3 compliant, with UL Recognized construction available for applicable connector and cable combinations.
Customization & Lead Time
Standard lead time for the Fine-Pitch FFC/FPC & Board-to-Board Cable Assemblies is 3–4 weeks prototype, 10–15 days production reorder. Connector type, cable length, and conductor configuration can be customized to match your exact application, including connector type, cable length, and shielding configuration to match your device’s board layout and enclosure design. Contact our engineering team with your drawings or requirements for a project-specific quote.
Why XinHarness
Fine-pitch interconnect work runs on the same ISO 9001 quality system as our broader electronics cable production, with compliance documentation ready for retail and OEM qualification. See the Electronics industry page, or request a quote for your project. For related technical background, see our article on the benefits of twisted-pair wiring for reducing electromagnetic interference.
Frequently Asked Questions
Yes, shielded cable, braided or foil shielding, and ferrite options are available to control EMI/RFI in sensitive electronic applications.
We support a wide range of board-to-board, wire-to-board, and industry-standard connector families; provide your preferred connector part number or mating requirement and we will match it.
Yes, all our consumer and industrial electronics cable assemblies, including the Fine-Pitch FFC/FPC & Board-to-Board Cable Assemblies, are manufactured using RoHS 3 and REACH-compliant materials.
